LAYER / INFILL SETTINGS IMPORTANT FOR THIS EFFECT!!
(although you could print solid if you wish...)
[ 0 top/bottom layers ]
[ 7 lines outer wall ]
[ 50% infill ] triangles, tri-hex, grid, any infill that stacks in the z-direction
[ supports: yes ]
[ build plate adhesion: skirt (glass+hairspray) brim (buildtak/tape/gluestick) ]
of the bed rewire options out there, this takes a more aesthetic approach by letting the infill pattern create a grille.
this addresses the problem presented with a slotted side panel that bends inward while trying to remove the microSD.
also added a grommet hole for bed rewire. this is to improve upon the idea of the famous "no-drill method" for heat bed rewiring.
also used a zip tie and cable wrap to manage the wiring. save filament, print wisely.
- 7 lines outer wall
- 0 top / bottom (no top/bottom layers)
- optimize print order
- alternate extra walls
- triangles, tri-hexagon, grid, or any infill pattern that stacks horizontally (excluding lines, cubic subdivision, cross, etc. may not work, or provide enough stability)
- disable "infill before outer walls"
used standard plastic cable wrap to keep wires together. reused grommet from the original wire route under heat bed.
added a zip tie to keep wires from moving too freely.