These brackets are made to be compatible with the pictured telecom panel (brand On-Q).
My telecom panel can fit two base shelves at the bottom of the panel; these allow for devices to be placed directly at the bottom of the panel and for air to continue to flow underneath.
The brackets come in different sizes to accommodate for devices of different thicknesses. They can be inserted in the square holes on the left and pinned in place using wall plugs/anchors with screw on the right side.
Glass heated platform temperature: 70 degrees Celsius.
Extruder temperature for PLA: 220 degrees Celsius.
For the base shelf, 15% infill is probably sufficient. However, for the brackets (especially the deeper ones), I recommend 30% infill with 4 perimeters/shells.
The base shelf does not require any support when printed upside down (slotted side down). The brackets require supports and should be printed slotted side down.
For PLA made parts, I recommend the use of skirt/brim to ensure good adhesion to the print bed.
I measured the spacing between the holes inside my telecom panel and the thickness of my different devices. I sketched the backplate in two dimensions and extruded it to form the three-dimensional model. I varied the thicknesses and rounded some corners until I obtained a decent strength without using too much filament to build. I also extruded out some slots at the base of the brackets to allow for the air to circulate while reducing the amount of filament required for the build.